KDINTEL386SXSA25
vs
TI486SLC-V25
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFP
|
|
| Package Description |
BQFP,
|
QFP,
|
| Pin Count |
100
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
NUMERIC COPROCESSOR INTERFACE
|
ADVANCED POWER MANAGEMENT FEATURES; HARDWARE MULTIPLIER
|
| Address Bus Width |
24
|
23
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| Length |
19.05 mm
|
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
2
|
2
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
100
|
100
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BQFP
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, BUMPER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
0
|
| Seated Height-Max |
4.57 mm
|
|
| Speed |
25 MHz
|
25 MHz
|
| Supply Current-Max |
175 mA
|
280 mA
|
| Supply Voltage-Max |
5.5 V
|
3.6 V
|
| Supply Voltage-Min |
4.5 V
|
2.7 V
|
| Supply Voltage-Nom |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
19.05 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare KDINTEL386SXSA25 with alternatives
Compare TI486SLC-V25 with alternatives