KDINTEL386SXSA25
vs
79RV308120PF
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
BQFP,
|
LQFP, QFP100,.63SQ,20
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
NUMERIC COPROCESSOR INTERFACE
|
|
| Address Bus Width |
24
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| External Data Bus Width |
16
|
32
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-PQFP-G100
|
R-PQFP-G100
|
| Length |
19.05 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
2
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
100
|
100
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BQFP
|
LQFP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, BUMPER
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
4.57 mm
|
1.6 mm
|
| Speed |
25 MHz
|
20 MHz
|
| Supply Current-Max |
175 mA
|
375 mA
|
| Supply Voltage-Max |
5.5 V
|
3.465 V
|
| Supply Voltage-Min |
4.5 V
|
3.135 V
|
| Supply Voltage-Nom |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
19.05 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
QFP100,.63SQ,20
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Terminal Finish |
|
Tin/Lead (Sn85Pb15)
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare KDINTEL386SXSA25 with alternatives
Compare 79RV308120PF with alternatives