KA556
vs
SE556F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
0.300 INCH, DIP-14
DIP, DIP14,.3
Pin Count
14
14
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
PULSE; RECTANGULAR
JESD-30 Code
R-PDIP-T14
R-CDIP-T14
Length
19.4 mm
Number of Functions
2
Number of Terminals
14
14
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Current-Max (Isup)
30 mA
Supply Voltage-Max (Vsup)
16 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
15 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
3
3
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare KA556 with alternatives
Compare SE556F with alternatives