K9F5608D0D-JCB00
vs
NAND256W3A0DZA6F
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
NUMONYX
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
VFBGA,
|
BGA,
|
| Pin Count |
63
|
63
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
30 ns
|
12000 ns
|
| JESD-30 Code |
R-PBGA-B63
|
R-PBGA-B63
|
| Length |
11 mm
|
|
| Memory Density |
268435456 bit
|
268435456 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
63
|
63
|
| Number of Words |
33554432 words
|
33554432 words
|
| Number of Words Code |
32000000
|
32000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
32MX8
|
32MX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
BGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
2.7 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
2.9 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
2.65 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
9 mm
|
|
| Base Number Matches |
1
|
2
|
| JESD-609 Code |
|
e1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare K9F5608D0D-JCB00 with alternatives
Compare NAND256W3A0DZA6F with alternatives