K9F5608D0D-JCB00 vs HY27SS08561M-FPCP feature comparison

K9F5608D0D-JCB00 Samsung Semiconductor

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HY27SS08561M-FPCP SK Hynix Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SK HYNIX INC
Part Package Code BGA BGA
Package Description VFBGA, TFBGA,
Pin Count 63 63
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 30 ns 10000 ns
JESD-30 Code R-PBGA-B63 R-PBGA-B63
Length 11 mm 11 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32MX8 32MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.2 mm
Supply Voltage-Max (Vsup) 2.9 V 1.95 V
Supply Voltage-Min (Vsup) 2.4 V 1.7 V
Supply Voltage-Nom (Vsup) 2.65 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 9 mm 9 mm
Base Number Matches 1 1
Rohs Code Yes
JESD-609 Code e1
Peak Reflow Temperature (Cel) 260
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) 20
Type SLC NAND TYPE

Compare K9F5608D0D-JCB00 with alternatives

Compare HY27SS08561M-FPCP with alternatives