K9F1208D0B-HIB00
vs
K9F1208D0B-YCB00
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
TSOP1
Package Description
VFBGA,
TSOP1,
Pin Count
63
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
30 ns
30 ns
Additional Feature
CONTAINS ADDITIONAL 16M BIT SPARE MEMORY
CONTAINS ADDITIONAL 16M BIT SPARE MEMORY
JESD-30 Code
R-PBGA-B63
R-PDSO-G48
JESD-609 Code
e1
e0
Length
13 mm
18.4 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Moisture Sensitivity Level
2
Number of Functions
1
1
Number of Terminals
63
48
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64MX8
64MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.9 mm
1.2 mm
Supply Voltage-Max (Vsup)
2.9 V
2.9 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
2.65 V
2.65 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
BOTTOM
DUAL
Width
8.5 mm
12 mm
Base Number Matches
1
1
Compare K9F1208D0B-HIB00 with alternatives
Compare K9F1208D0B-YCB00 with alternatives