K9F1208D0B-YCB00
vs
K9K1208D0C-JCB00
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP1
BGA
Package Description
TSOP1,
TFBGA, BGA63,10X12,32
Pin Count
48
63
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
30 ns
30 ns
Additional Feature
CONTAINS ADDITIONAL 16M BIT SPARE MEMORY
JESD-30 Code
R-PDSO-G48
R-PBGA-B63
JESD-609 Code
e0
Length
18.4 mm
11 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
63
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64MX8
64MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
2.9 V
2.9 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
2.65 V
2.65 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Width
12 mm
9 mm
Base Number Matches
1
1
Command User Interface
YES
Data Polling
NO
Number of Sectors/Size
4K
Package Equivalence Code
BGA63,10X12,32
Page Size
512 words
Ready/Busy
YES
Sector Size
16K
Standby Current-Max
0.00005 A
Supply Current-Max
0.02 mA
Toggle Bit
NO
Compare K9F1208D0B-YCB00 with alternatives
Compare K9K1208D0C-JCB00 with alternatives