K8P2815UQC-GC4B0
vs
S29PL127J65BFW02
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
VFBGA,
Pin Count
80
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
65 ns
Additional Feature
BOTTOM BOOT BLOCK, TOP BOOT BLOCK
Boot Block
BOTTOM/TOP
JESD-30 Code
R-PBGA-B80
Length
11 mm
Memory Density
134217728 bit
Memory IC Type
FLASH
Memory Width
16
Number of Functions
1
Number of Terminals
80
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
8MX16
Package Body Material
PLASTIC/EPOXY
Package Code
VFBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Width
8 mm
Base Number Matches
1
3
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