K8P2815UQC-GC4B0 vs S29PL127J65BAI03 feature comparison

K8P2815UQC-GC4B0 Samsung Semiconductor

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S29PL127J65BAI03 Spansion

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SPANSION INC
Part Package Code BGA BGA
Package Description VFBGA, 8 X 11 MM, FBGA-80
Pin Count 80 80
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 65 ns 65 ns
Additional Feature BOTTOM BOOT BLOCK, TOP BOOT BLOCK TOP AND BOTTOM BOOT BLOCK
Boot Block BOTTOM/TOP BOTTOM/TOP
JESD-30 Code R-PBGA-B80 R-PBGA-B80
Length 11 mm 11 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 80 80
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 3
Pbfree Code Yes
Rohs Code Yes
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-609 Code e1
Moisture Sensitivity Level 3
Number of Sectors/Size 16,254
Package Equivalence Code BGA64,10X12,32
Page Size 8 words
Ready/Busy YES
Sector Size 4K,32K
Standby Current-Max 0.000005 A
Supply Current-Max 0.07 mA
Terminal Finish TIN SILVER COPPER
Toggle Bit YES
Type NOR TYPE

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