K8D3216UBCLC0700
vs
SST39VF3201B-70-4I-B3KE
feature comparison
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, TBGA-48
|
6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
3A991.B.1.A
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
70 ns
|
70 ns
|
| Alternate Memory Width |
8
|
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
| Length |
8.5 mm
|
8 mm
|
| Memory Density |
33554432 bit
|
33554432 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
2MX16
|
2MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
2.7 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
6 mm
|
6 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
13 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Additional Feature |
|
BOTTOM BOOT BLOCK
|
| Command User Interface |
|
YES
|
| Common Flash Interface |
|
YES
|
| Data Polling |
|
YES
|
| Endurance |
|
10000 Write/Erase Cycles
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Number of Ports |
|
1
|
| Number of Sectors/Size |
|
1K
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
BGA48,6X8,32
|
| Sector Size |
|
2K
|
| Standby Current-Max |
|
0.00002 A
|
| Supply Current-Max |
|
0.045 mA
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Toggle Bit |
|
YES
|
|
|
|
Compare K8D3216UBCLC0700 with alternatives
Compare SST39VF3201B-70-4I-B3KE with alternatives