K8D3216UBCLC0700
vs
K8D3216UBC-TC070
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, TBGA-48
6 X 8.50 MM, 0.80 MM PITCH, TBGA-48
Pin Count
48
48
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM
BOTTOM
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
8.5 mm
8.5 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
6 mm
6 mm
Base Number Matches
1
1
Rohs Code
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
Number of Sectors/Size
8,63
Package Equivalence Code
BGA48,6X8,32
Peak Reflow Temperature (Cel)
240
Ready/Busy
YES
Sector Size
8K,64K
Standby Current-Max
0.000018 A
Supply Current-Max
0.05 mA
Time@Peak Reflow Temperature-Max (s)
30
Toggle Bit
YES
Compare K8D3216UBCLC0700 with alternatives
Compare K8D3216UBC-TC070 with alternatives