K7P163612M-HC48 vs ICY7C1373C-100BGI feature comparison

K7P163612M-HC48 Samsung Semiconductor

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ICY7C1373C-100BGI Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description BGA, BGA119,7X17,50 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
Pin Count 119 119
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 4.8 ns 8.5 ns
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e0
Length 22 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type STANDARD SRAM ZBT SRAM
Memory Width 36 18
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 524288 words 1048576 words
Number of Words Code 512000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX36 1MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.4 mm
Standby Current-Max 0.15 A
Standby Voltage-Min 3.15 V
Supply Current-Max 0.5 mA
Supply Voltage-Max (Vsup) 3.45 V 3.63 V
Supply Voltage-Min (Vsup) 3.15 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Additional Feature FLOW-THROUGH ARCHITECTURE

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