K7N801849A-TC22 vs IDT71V65703S80B feature comparison

K7N801849A-TC22 Samsung Semiconductor

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IDT71V65703S80B Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP BGA
Package Description LQFP, 14 X 22 MM, PLASTIC, MS-026AA, BGA-119
Pin Count 100 119
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 2.8 ns 8 ns
JESD-30 Code R-PQFP-G100 R-PBGA-B119
Length 20 mm 22 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 100 119
Number of Words 524288 words 262144 words
Number of Words Code 512000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX18 256KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.36 mm
Supply Voltage-Max (Vsup) 2.625 V 3.465 V
Supply Voltage-Min (Vsup) 2.375 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Additional Feature FLOW-THROUGH ARCHITECTURE
JESD-609 Code e0
Terminal Finish TIN LEAD

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Compare IDT71V65703S80B with alternatives