IDT71V65703S80B vs TC55VL836FF-84 feature comparison

IDT71V65703S80B Integrated Device Technology Inc

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TC55VL836FF-84 Toshiba America Electronic Components

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC TOSHIBA CORP
Part Package Code BGA QFP
Package Description 14 X 22 MM, PLASTIC, MS-026AA, BGA-119 LQFP, QFP100,.63X.87
Pin Count 119 100
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 8 ns 9 ns
Additional Feature FLOW-THROUGH ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PQFP-G100
JESD-609 Code e0 e0
Length 22 mm 20 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type ZBT SRAM STANDARD SRAM
Memory Width 36 36
Number of Functions 1 1
Number of Terminals 119 100
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX36 256KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.36 mm 1.7 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 14 mm 14 mm
Base Number Matches 1 1
Rohs Code No
Clock Frequency-Max (fCLK) 83 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code QFP100,.63X.87
Standby Current-Max 0.01 A
Standby Voltage-Min 3.14 V

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