K7N323601M-QC130
vs
GS8320E36AGT-375
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
GSI TECHNOLOGY
Part Package Code
QFP
QFP
Package Description
LQFP,
LQFP, QFP100,.63X.87
Pin Count
100
100
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
4.2 ns
4.2 ns
Additional Feature
PIPELINED ARCHITECTURE
ALSO OPERATED WITH 3.3V SUPPLY; PIPELINE/FLOW THROUGH ARCHITECTURE
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
Length
20 mm
20 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
ZBT SRAM
CACHE SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX36
1MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.465 V
2.7 V
Supply Voltage-Min (Vsup)
3.135 V
2.3 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
Base Number Matches
1
1
Rohs Code
Factory Lead Time
24 Weeks
Clock Frequency-Max (fCLK)
375 MHz
I/O Type
COMMON
JESD-609 Code
e3
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63X.87
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Standby Current-Max
0.03 A
Standby Voltage-Min
2.3 V
Supply Current-Max
0.34 mA
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare K7N323601M-QC130 with alternatives
Compare GS8320E36AGT-375 with alternatives