K7D323674C-GC370
vs
K7D323674A-GC400
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA153,9X17,50
BGA,
Pin Count
153
153
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
375 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B153
R-PBGA-B153
JESD-609 Code
e1
e1
Length
22 mm
22 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
DDR SRAM
DDR SRAM
Memory Width
36
36
Moisture Sensitivity Level
2
2
Number of Functions
1
1
Number of Terminals
153
153
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX36
1MX36
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA153,9X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.21 mm
2.21 mm
Standby Current-Max
0.3 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.65 mA
Supply Voltage-Max (Vsup)
2.6 V
2.6 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Compare K7D323674C-GC370 with alternatives
Compare K7D323674A-GC400 with alternatives