Datasheets
K7D323674C-GC370 by: Samsung Semiconductor

DDR SRAM, 1MX36, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-153

Part Details for K7D323674C-GC370 by Samsung Semiconductor

Overview of K7D323674C-GC370 by Samsung Semiconductor

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Applications Consumer Electronics Computing and Data Storage

Part Details for K7D323674C-GC370

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K7D323674C-GC370 Part Data Attributes

K7D323674C-GC370 Samsung Semiconductor
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K7D323674C-GC370 Samsung Semiconductor DDR SRAM, 1MX36, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-153
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA
Package Description BGA, BGA153,9X17,50
Pin Count 153
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 375 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B153
JESD-609 Code e1
Length 22 mm
Memory Density 37748736 bit
Memory IC Type DDR SRAM
Memory Width 36
Moisture Sensitivity Level 2
Number of Functions 1
Number of Terminals 153
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA153,9X17,50
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 2.21 mm
Standby Current-Max 0.3 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.65 mA
Supply Voltage-Max (Vsup) 2.6 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 14 mm

Alternate Parts for K7D323674C-GC370

This table gives cross-reference parts and alternative options found for K7D323674C-GC370. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7D323674C-GC370, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
K7D323674C-HC37 Standard SRAM, 1MX36, CMOS, PBGA153 Samsung Semiconductor K7D323674C-GC370 vs K7D323674C-HC37
Part Number Description Manufacturer Compare
K7D323674C-GC330 DDR SRAM, 1MX36, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-153 Samsung Semiconductor K7D323674C-GC370 vs K7D323674C-GC330
K7D323674A-GC400 DDR SRAM, 1MX36, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-153 Samsung Semiconductor K7D323674C-GC370 vs K7D323674A-GC400
K7D323674A-HC400 DDR SRAM, 1MX36, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 Samsung Semiconductor K7D323674C-GC370 vs K7D323674A-HC400
K7D323674A-GC370 DDR SRAM, 1MX36, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-153 Samsung Semiconductor K7D323674C-GC370 vs K7D323674A-GC370
K7D323674A-HC330 DDR SRAM, 1MX36, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 Samsung Semiconductor K7D323674C-GC370 vs K7D323674A-HC330
K7D323674C-GC400 DDR SRAM, 1MX36, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-153 Samsung Semiconductor K7D323674C-GC370 vs K7D323674C-GC400

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