K7B403225M-QC90 vs MT58LC128K32B3S27BWC2-9 feature comparison

K7B403225M-QC90 Samsung Semiconductor

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MT58LC128K32B3S27BWC2-9 Micron Technology Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MICRON TECHNOLOGY INC
Package Description LQFP, QFP100,.63X.87 DIE,
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 9 ns 9 ns
Clock Frequency-Max (fCLK) 83 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100 X-XUUC-N94
JESD-609 Code e0
Length 20 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 32 32
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 100 94
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX32 128KX32
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code LQFP DIE
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR UNSPECIFIED
Package Style FLATPACK, LOW PROFILE UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Standby Current-Max 0.03 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.3 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm
Terminal Position QUAD UPPER
Width 14 mm
Base Number Matches 1 1
Number of Ports 1
Output Enable YES

Compare K7B403225M-QC90 with alternatives

Compare MT58LC128K32B3S27BWC2-9 with alternatives