K6T8016C3M-RF550
vs
CY62157ELL-45ZSXI
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
TSOP2
|
TSOP2
|
Package Description |
TSOP2-R,
|
LEAD FREE, TSOP2-44
|
Pin Count |
44
|
44
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
|
HTS Code |
8542.32.00.41
|
|
Access Time-Max |
55 ns
|
45 ns
|
JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G44
|
Length |
18.41 mm
|
18.415 mm
|
Memory Density |
8388608 bit
|
8388608 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
44
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
512KX16
|
512KX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSOP2-R
|
TSOP2
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
1.2 mm
|
1.194 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
10.16 mm
|
10.16 mm
|
Base Number Matches |
1
|
3
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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