K6T4008C1B-DB550 vs EDI88512LPA55F32I feature comparison

K6T4008C1B-DB550 Samsung Semiconductor

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EDI88512LPA55F32I Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MICROSEMI CORP
Part Package Code DIP DFP
Package Description DIP, CERAMIC, DFP-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-PDIP-T32 R-CDFP-F32
Length 41.91 mm 21.2852 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX8 512KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2.8448 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 15.24 mm 10.7442 mm
Base Number Matches 1 4
Pbfree Code No
Rohs Code No
Additional Feature TTL COMPATIBLE INPUTS/OUTPUTS; LG-MAX
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code FL32,.4
Peak Reflow Temperature (Cel) NOT SPECIFIED
Standby Current-Max 0.002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.225 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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