K6T0808V1D-TB70
vs
CY62256VNLL-70ZXA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
TSOP
TSOP
Package Description
TSOP1, TSSOP28,.53,22
8 X 13.40 MM, LEAD FREE, TSOP1-28
Pin Count
28
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G28
R-PDSO-G28
JESD-609 Code
e0
e4
Length
11.8 mm
11.8 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Equivalence Code
TSSOP28,.53,22
TSSOP28,.53,22
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Voltage-Min
2 V
1.4 V
Supply Current-Max
0.035 mA
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.55 mm
0.55 mm
Terminal Position
DUAL
DUAL
Width
8 mm
8 mm
Base Number Matches
1
2
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.000006 A
Time@Peak Reflow Temperature-Max (s)
20
Compare K6T0808V1D-TB70 with alternatives
Compare CY62256VNLL-70ZXA with alternatives