K5A3340YBC-T7550 vs AM42BDS640AGBD9FT feature comparison

K5A3340YBC-T7550 Samsung Semiconductor

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AM42BDS640AGBD9FT Spansion

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SPANSION INC
Part Package Code BGA BGA
Package Description TFBGA, LFBGA,
Pin Count 69 93
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature SRAM IS ORGANIZED AS 512K X 8 / 256K X 16; NOR FLASH CAN ALSO BE ORGANIZED AS 4M X 8 STATIC RAM IS ORGANISED AS 1M X 16
JESD-30 Code R-PBGA-B69 R-PBGA-B93
Length 11 mm 11.6 mm
Memory Density 33554432 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 69 93
Number of Words 2097152 words 4194304 words
Number of Words Code 2000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.3 V 1.95 V
Supply Voltage-Min (Vsup) 2.7 V 1.65 V
Supply Voltage-Nom (Vsup) 3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 1
Rohs Code Yes
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

Compare K5A3340YBC-T7550 with alternatives

Compare AM42BDS640AGBD9FT with alternatives