K4T51043QI-HCE6
vs
HY5DU12422CFP-D43
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SK HYNIX INC
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Time-Max
0.45 ns
0.7 ns
Clock Frequency-Max (fCLK)
333 MHz
200 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
4,8
2,4,8
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e1
e1
Memory Density
536870912 bit
536870912 bit
Memory IC Type
DDR2 DRAM
DDR1 DRAM
Memory Width
4
4
Moisture Sensitivity Level
2
Number of Terminals
60
60
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Temperature-Max
95 °C
70 °C
Operating Temperature-Min
Organization
128MX4
128MX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
TBGA
Package Equivalence Code
BGA60,9X11,32
BGA60,9X12,40/32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, THIN PROFILE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
8192
Sequential Burst Length
4,8
2,4,8
Standby Current-Max
0.008 A
0.01 A
Supply Current-Max
0.115 mA
Supply Voltage-Nom (Vsup)
1.8 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Part Package Code
BGA
Package Description
TBGA, BGA60,9X12,40/32
Pin Count
60
Access Mode
FOUR BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
Length
12 mm
Number of Functions
1
Number of Ports
1
Operating Mode
SYNCHRONOUS
Seated Height-Max
1.2 mm
Self Refresh
YES
Supply Voltage-Max (Vsup)
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
10 mm
Compare K4T51043QI-HCE6 with alternatives
Compare HY5DU12422CFP-D43 with alternatives