K4T1G044QC-ZLCC
vs
MT47H256M4HV-5EL:E
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MICRON TECHNOLOGY INC
Package Description
FBGA, BGA60,9X11,32
8 X 11.50 MM, FBGA-60
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Time-Max
0.6 ns
0.6 ns
Clock Frequency-Max (fCLK)
200 MHz
200 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
4,8
4,8
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e1
e0
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
DDR2 DRAM
DDR2 DRAM
Memory Width
4
4
Moisture Sensitivity Level
3
Number of Terminals
60
60
Number of Words
268435456 words
268435456 words
Number of Words Code
256000000
256000000
Organization
256MX4
256MX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
TFBGA
Package Equivalence Code
BGA60,9X11,32
BGA60,9X11,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
8192
Sequential Burst Length
4,8
4,8
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN SILVER COPPER
TIN LEAD SILVER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
60
Access Mode
MULTI BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
Length
11.5 mm
Number of Functions
1
Number of Ports
1
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
Seated Height-Max
1.2 mm
Self Refresh
YES
Supply Current-Max
0.26 mA
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Temperature Grade
OTHER
Width
8 mm
Compare K4T1G044QC-ZLCC with alternatives
Compare MT47H256M4HV-5EL:E with alternatives