K4M563233G-FN750
vs
K4M563233G-HG75T
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
|
Package Description |
VFBGA, BGA90,9X15,32
|
FBGA, BGA90,9X15,32
|
Pin Count |
90
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.24
|
8542.32.00.24
|
Access Mode |
FOUR BANK PAGE BURST
|
|
Access Time-Max |
5.4 ns
|
5.4 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
|
Clock Frequency-Max (fCLK) |
133 MHz
|
133 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
1,2,4,8
|
1,2,4,8
|
JESD-30 Code |
R-PBGA-B90
|
R-PBGA-B90
|
Length |
13 mm
|
|
Memory Density |
268435456 bit
|
268435456 bit
|
Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
|
Number of Ports |
1
|
|
Number of Terminals |
90
|
90
|
Number of Words |
8388608 words
|
8388608 words
|
Number of Words Code |
8000000
|
8000000
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-25 °C
|
Organization |
8MX32
|
8MX32
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
FBGA
|
Package Equivalence Code |
BGA90,9X15,32
|
BGA90,9X15,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel) |
240
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
4096
|
4096
|
Seated Height-Max |
1 mm
|
|
Self Refresh |
YES
|
|
Sequential Burst Length |
1,2,4,8,FP
|
1,2,4,8,FP
|
Standby Current-Max |
0.001 A
|
0.001 A
|
Supply Current-Max |
0.16 mA
|
0.16 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
2.7 V
|
|
Supply Voltage-Nom (Vsup) |
3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
8 mm
|
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare K4M563233G-FN750 with alternatives
Compare K4M563233G-HG75T with alternatives