K4H560438E-VCB30
vs
DPSD64MX4TY5-DP-XX08
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
DPAC TECHNOLOGIES CORP
|
| Part Package Code |
TSOP2
|
TSOP2
|
| Package Description |
TSOP2,
|
ATSOP,
|
| Pin Count |
54
|
54
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.24
|
8542.32.00.24
|
| Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
| Access Time-Max |
0.7 ns
|
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| JESD-30 Code |
R-PDSO-G54
|
R-PDSO-G54
|
| Length |
14 mm
|
|
| Memory Density |
268435456 bit
|
268435456 bit
|
| Memory IC Type |
DDR1 DRAM
|
SYNCHRONOUS DRAM
|
| Memory Width |
4
|
4
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
54
|
54
|
| Number of Words |
67108864 words
|
67108864 words
|
| Number of Words Code |
64000000
|
64000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
64MX4
|
64MX4
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP2
|
ATSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, PIGGYBACK, THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
2.59 mm
|
| Self Refresh |
YES
|
YES
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.6 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare K4H560438E-VCB30 with alternatives
Compare DPSD64MX4TY5-DP-XX08 with alternatives