K4H560438E-VCB0
vs
K4H560438E-NCB0T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Package Description
TSSOP, TSSOP54,.36,20
TSSOP, TSSOP54,.36,20
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.24
Access Time-Max
0.75 ns
0.75 ns
Clock Frequency-Max (fCLK)
133 MHz
133 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
2,4,8
2,4,8
JESD-30 Code
R-PDSO-G54
R-PDSO-G54
JESD-609 Code
e3
Memory Density
268435456 bit
268435456 bit
Memory IC Type
DDR1 DRAM
CACHE DRAM MODULE
Memory Width
4
4
Moisture Sensitivity Level
1
3
Number of Terminals
54
54
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64MX4
64MX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP54,.36,20
TSSOP54,.36,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
8192
Sequential Burst Length
2,4,8
2,4,8
Standby Current-Max
0.003 A
0.003 A
Supply Current-Max
0.24 mA
0.24 mA
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
240
Compare K4H560438E-VCB0 with alternatives
Compare K4H560438E-NCB0T with alternatives