K4H510838C-ZCCC
vs
K4H510838C-ZCCCT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SAMSUNG SEMICONDUCTOR INC
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.28
|
8542.32.00.28
|
Access Time-Max |
0.65 ns
|
0.65 ns
|
Clock Frequency-Max (fCLK) |
200 MHz
|
200 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
2,4,8
|
2,4,8
|
JESD-30 Code |
R-PBGA-B60
|
R-PBGA-B60
|
JESD-609 Code |
e1
|
e3
|
Memory Density |
536870912 bit
|
536870912 bit
|
Memory IC Type |
DDR1 DRAM
|
DDR1 DRAM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
3
|
1
|
Number of Terminals |
60
|
60
|
Number of Words |
67108864 words
|
67108864 words
|
Number of Words Code |
64000000
|
64000000
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
64MX8
|
64MX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA60,9X12,40/32
|
BGA60,9X12,40/32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
8192
|
8192
|
Sequential Burst Length |
2,4,8
|
2,4,8
|
Standby Current-Max |
0.005 A
|
0.005 A
|
Supply Current-Max |
0.385 mA
|
0.385 mA
|
Supply Voltage-Nom (Vsup) |
2.6 V
|
2.6 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
1
|
1
|
Package Description |
|
BGA, BGA60,9X12,40/32
|
|
|
|
Compare K4H510838C-ZCCC with alternatives
Compare K4H510838C-ZCCCT with alternatives