K4H1G0638B-UCB00
vs
K4H1G0438M-ULA20
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP2
TSOP2
Package Description
SSOP, SSOP66,.46
TSOP2,
Pin Count
66
66
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.75 ns
0.75 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
JESD-30 Code
R-PDSO-G66
R-PDSO-G66
Length
22.22 mm
22.22 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
DDR DRAM MODULE
DDR1 DRAM
Memory Width
4
4
Moisture Sensitivity Level
3
2
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
66
66
Number of Words
268435456 words
268435456 words
Number of Words Code
256000000
256000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256MX4
256MX4
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
TSOP2
Package Equivalence Code
SSOP66,.46
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
Seated Height-Max
2.59 mm
1.2 mm
Self Refresh
YES
YES
Standby Current-Max
0.01 A
Supply Current-Max
0.39 mA
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
10.16 mm
Base Number Matches
1
1
Compare K4H1G0638B-UCB00 with alternatives
Compare K4H1G0438M-ULA20 with alternatives