K4D263238I-QC500
vs
K4D263238M-QC550
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
QFP
QFP
Package Description
TQFP,
TQFP,
Pin Count
100
100
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.7 ns
0.75 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e0
Length
20 mm
20 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
GDDR1 DRAM
DDR DRAM
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
100
100
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
65 °C
65 °C
Operating Temperature-Min
Organization
4MX32
4MX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TQFP
TQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, THIN PROFILE
FLATPACK, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
30
Compare K4D263238I-QC500 with alternatives
Compare K4D263238M-QC550 with alternatives