K4B4G0446B-MCF80
vs
MT41J1G4THD-25:D
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
LFBGA, BGA78,9X13,32
TFBGA,
Pin Count
78
78
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
MULTI BANK PAGE BURST
DUAL BANK PAGE BURST
Access Time-Max
0.3 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
533 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B78
R-PBGA-B78
Length
11.5 mm
11.5 mm
Memory Density
4294967296 bit
4294967296 bit
Memory IC Type
DDR3 DRAM
DDR3 DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
78
78
Number of Words
1073741824 words
1073741824 words
Number of Words Code
1000000000
1000000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
1GX4
1GX4
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TFBGA
Package Equivalence Code
BGA78,9X13,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
Seated Height-Max
1.5 mm
1.2 mm
Self Refresh
YES
YES
Standby Current-Max
0.024 A
Supply Current-Max
0.25 mA
Supply Voltage-Max (Vsup)
1.575 V
1.575 V
Supply Voltage-Min (Vsup)
1.425 V
1.425 V
Supply Voltage-Nom (Vsup)
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
10 mm
9 mm
Base Number Matches
1
1
JESD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
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