K3P6C1000F-TC100 vs UPD23C32000ALGX-XXX-A feature comparison

K3P6C1000F-TC100 Samsung Semiconductor

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UPD23C32000ALGX-XXX-A Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC RENESAS ELECTRONICS CORP
Part Package Code TSOP2 SOIC
Package Description SOP, SOP,
Pin Count 44 44
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 100 ns 150 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G44 R-PDSO-G44
Length 18.41 mm 27.83 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -10 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 3 mm
Supply Current-Max 0.15 mA 0.04 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 10
Width 10.16 mm 13.24 mm
Base Number Matches 1 1
JESD-609 Code e3/e6
Terminal Finish MATTE TIN/TIN BISMUTH

Compare K3P6C1000F-TC100 with alternatives

Compare UPD23C32000ALGX-XXX-A with alternatives