K3N6V4000E-DC12 vs M27V322-150XF1 feature comparison

K3N6V4000E-DC12 Samsung Semiconductor

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M27V322-150XF1 STMicroelectronics

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP42,.6 0.315 X 0.630 INCH, ROHS COMPLIANT, CERAMIC, FDIP-42
Pin Count 42 42
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.61
Access Time-Max 120 ns 150 ns
JESD-30 Code R-PDIP-T42 R-CDIP-T42
JESD-609 Code e0 e3
Length 52.42 mm 54.635 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MASK ROM UVPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP WDIP
Package Equivalence Code DIP42,.6 DIP42,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.72 mm
Standby Current-Max 0.00003 A 0.00006 A
Supply Current-Max 0.04 mA 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V 3.465 V
Supply Voltage-Min (Vsup) 3 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
I/O Type COMMON
Output Characteristics 3-STATE

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Compare M27V322-150XF1 with alternatives