K3N6V1000E-GC100
vs
UPD23C32000ALGX-XXX-A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
NEC ELECTRONICS AMERICA INC
Part Package Code
SOIC
Package Description
SOP,
15.24 MM, LEAD FREE, PLASTIC, SOP-44
Pin Count
44
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
100 ns
150 ns
Alternate Memory Width
8
8
JESD-30 Code
R-PDSO-G44
R-PDSO-G44
Length
28.5 mm
27.83 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-10 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.1 mm
3 mm
Supply Current-Max
0.04 mA
0.04 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
10
Width
12.6 mm
13.24 mm
Base Number Matches
1
2
JESD-609 Code
e3/e6
Terminal Finish
MATTE TIN/TIN BISMUTH
Compare K3N6V1000E-GC100 with alternatives
Compare UPD23C32000ALGX-XXX-A with alternatives