K3N6C1500C-TE15 vs MX23C3211MC-15 feature comparison

K3N6C1500C-TE15 Samsung Semiconductor

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MX23C3211MC-15 Macronix International Co Ltd

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MACRONIX INTERNATIONAL CO LTD
Part Package Code TSOP2 SOIC
Package Description SOP, SOP,
Pin Count 44 44
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 200 ns
Additional Feature ALSO CONFIGURABLE AS 2M X 16 WITH PAGE MODE FUNCTION; PAGE MODE ACCESS TIME = 70NS
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e0 e0
Memory Density 33554432 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -20 °C
Organization 4MX8 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 1
Alternate Memory Width 16
Output Characteristics 3-STATE
Seated Height-Max 3 mm
Terminal Pitch 1.27 mm
Width 12.6 mm

Compare K3N6C1500C-TE15 with alternatives

Compare MX23C3211MC-15 with alternatives