K3N6C1000C-TC15 vs AM29F032B-75SIB feature comparison

K3N6C1000C-TC15 Samsung Semiconductor

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AM29F032B-75SIB Spansion

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SPANSION INC
Part Package Code TSOP2 SOIC
Package Description TSOP2, TSOP44,.46,32 SOP-44
Pin Count 44 44
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.51
Access Time-Max 150 ns 70 ns
Alternate Memory Width 8
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e0 e0
Length 18.41 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MASK ROM FLASH
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 2097152 words 4194304 words
Number of Words Code 2000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2MX16 4MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 SOP
Package Equivalence Code TSOP44,.46,32
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm
Terminal Position DUAL DUAL
Width 10.16 mm
Base Number Matches 2 1
Additional Feature 1000K WRITE/ERASE CYCLES MIN
Moisture Sensitivity Level 3
Programming Voltage 5 V
Type NOR TYPE

Compare K3N6C1000C-TC15 with alternatives

Compare AM29F032B-75SIB with alternatives