JM38510/34001BDA vs N54F08/BDA feature comparison

JM38510/34001BDA Motorola Semiconductor Products

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N54F08/BDA NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description CERAMIC, FP-14 DFP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-GDFP-F14 R-CDFP-F14
Length 9.65 mm 9.906 mm
Logic IC Type AND GATE AND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Propagation Delay (tpd) 7.5 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.15 mm 2.159 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 6.415 mm 6.2865 mm
Base Number Matches 1 1
Part Package Code DFP
Pin Count 14
Load Capacitance (CL) 50 pF
Power Supply Current-Max (ICC) 12.9 mA

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