N54F08/BDA vs 54F08/BDAJC feature comparison

N54F08/BDA NXP Semiconductors

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54F08/BDAJC Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code DFP
Package Description DFP, CERAMIC, FP-14
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-CDFP-F14 R-GDFP-F14
Length 9.906 mm 9.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DFP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Power Supply Current-Max (ICC) 12.9 mA 12.9 mA
Propagation Delay (tpd) 7.5 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.159 mm 2.15 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 6.2865 mm 6.415 mm
Base Number Matches 1 3
Rohs Code No
JESD-609 Code e0
Max I(ol) 0.02 A
Package Equivalence Code FL14,.3
Prop. Delay@Nom-Sup 7.5 ns
Schmitt Trigger NO
Screening Level 38535Q/M;38534H;883B
Terminal Finish TIN LEAD

Compare N54F08/BDA with alternatives

Compare 54F08/BDAJC with alternatives