N54F08/BDA
vs
54F08/BDAJC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
DFP
Package Description
DFP,
CERAMIC, FP-14
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
F/FAST
JESD-30 Code
R-CDFP-F14
R-GDFP-F14
Length
9.906 mm
9.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DFP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Power Supply Current-Max (ICC)
12.9 mA
12.9 mA
Propagation Delay (tpd)
7.5 ns
7.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.159 mm
2.15 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
6.2865 mm
6.415 mm
Base Number Matches
1
3
Rohs Code
JESD-609 Code
e0
Max I(ol)
0.02 A
Package Equivalence Code
FL14,.3
Prop. Delay@Nom-Sup
7.5 ns
Schmitt Trigger
NO
Screening Level
38535Q/M;38534H;883B
Terminal Finish
TIN LEAD
Compare N54F08/BDA with alternatives
Compare 54F08/BDAJC with alternatives