JM38510/32501BRA
vs
N74ABT273N
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
No
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
CERAMIC, DIP-20
DIP,
Pin Count
20
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
ABT
JESD-30 Code
R-GDIP-T20
R-PDIP-T20
JESD-609 Code
e0
Length
24.195 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max I(ol)
0.008 A
Number of Bits
8
8
Number of Functions
8
1
Number of Terminals
20
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
TUBE
Power Supply Current-Max (ICC)
27 mA
30 mA
Propagation Delay (tpd)
27 ns
7.3 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-M-38510
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
BICMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
fmax-Min
35 MHz
150 MHz
Base Number Matches
1
1
Load Capacitance (CL)
50 pF
Compare JM38510/32501BRA with alternatives
Compare N74ABT273N with alternatives