JM38510/30901BFA vs 74HCT253DB,118 feature comparison

JM38510/30901BFA Motorola Semiconductor Products

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74HCT253DB,118 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description DFP, SSOP, SSOP16,.3
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HCT
JESD-30 Code R-GDFP-F16 R-PDSO-G16
Length 9.65 mm 6.2 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 2
Number of Inputs 8 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DFP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 56 ns 60 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.15 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form FLAT GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 6.415 mm 5.3 mm
Base Number Matches 3 2
Rohs Code Yes
Part Package Code SSOP1
Pin Count 16
Manufacturer Package Code SOT338-1
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Package Equivalence Code SSOP16,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 57 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

Compare JM38510/30901BFA with alternatives

Compare 74HCT253DB,118 with alternatives