74HCT253DB,118 vs SN74LS354FNR feature comparison

74HCT253DB,118 NXP Semiconductors

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SN74LS354FNR Texas Instruments

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SSOP1
Package Description SSOP, SSOP16,.3 QCCJ,
Pin Count 16
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT LS
JESD-30 Code R-PDSO-G16 S-PQCC-J20
JESD-609 Code e4
Length 6.2 mm 8.9662 mm
Load Capacitance (CL) 50 pF 45 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Number of Functions 2 1
Number of Inputs 4 8
Number of Outputs 1 1
Number of Terminals 16 20
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP QCCJ
Package Equivalence Code SSOP16,.3
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, SHRINK PITCH CHIP CARRIER
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 57 ns
Propagation Delay (tpd) 60 ns 45 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 4.57 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS TTL
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING J BEND
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm 8.9662 mm
Base Number Matches 2 1
Additional Feature TRANSPARENT ADDRESS LATCHES
Power Supply Current-Max (ICC) 46 mA

Compare 74HCT253DB,118 with alternatives

Compare SN74LS354FNR with alternatives