JM38510/30007BCA vs JM38510/30007BCA feature comparison

JM38510/30007BCA Philips Semiconductors

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JM38510/30007BCA Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SIGNETICS CORP TEXAS INSTRUMENTS INC
Package Description , CERAMIC, DIP-14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Load Capacitance (CL) 15 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 2 2
Number of Inputs 4 4
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 2.2 mA 2.2 mA
Propagation Delay (tpd) 15 ns 15 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code No
Part Package Code DIP
Pin Count 14
ECCN Code EAR99
JESD-609 Code e0
Length 19.56 mm
Max I(ol) 0.0004 A
Packing Method TUBE
Prop. Delay@Nom-Sup 24 ns
Schmitt Trigger NO
Screening Level MIL-M-38510 Class B
Seated Height-Max 5.08 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare JM38510/30007BCA with alternatives

Compare JM38510/30007BCA with alternatives