JM38510/05003BCA
vs
MC14023UBALD
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
4000/14000/40000
JESD-30 Code
R-GDIP-T14
R-XDIP-T14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
3
Number of Inputs
3
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
12 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
3
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP14,.3
Power Supplies
5/15 V
Schmitt Trigger
NO
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Compare JM38510/05003BCA with alternatives