JM38510/05003BCA
vs
CD4012BCJ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
3
2
Number of Inputs
3
4
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
12 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
2
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
14
JESD-609 Code
e0
Length
19.43 mm
Load Capacitance (CL)
50 pF
Package Equivalence Code
DIP14,.3
Propagation Delay (tpd)
250 ns
Schmitt Trigger
NO
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare JM38510/05003BCA with alternatives
Compare CD4012BCJ with alternatives