Findchips: Compare JM38510/00803BCC vs M38510/00803BAX

JM38510/00803BCC vs M38510/00803BAX feature comparison

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Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	SIGNETICS CORP	ROCHESTER ELECTRONICS LLC
Package Description	,	DIP,
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	TTL/H/L	TTL/H/L
JESD-30 Code	R-GDIP-T14	R-GDIP-T14
Load Capacitance (CL)	15 pF
Logic IC Type	BUFFER	BUFFER
Number of Functions	6	6
Number of Inputs	1	1
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Output Characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR
Package Body Material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
Package Code	DIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Power Supply Current-Max (ICC)	41 mA
Propagation Delay (tpd)	30 ns	30 ns
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	TTL	TTL
Temperature Grade	MILITARY	MILITARY
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Position	DUAL	DUAL
Base Number Matches	3	3
Length		19.56 mm
Peak Reflow Temperature (Cel)		NOT APPLICABLE
Seated Height-Max		5.08 mm
Terminal Pitch		2.54 mm
Time@Peak Reflow Temperature-Max (s)		NOT APPLICABLE
Width		7.62 mm
	Logic » Gates	Logic » Gates