JANTXV1N5623US vs 1N5623GP feature comparison

JANTXV1N5623US Microchip Technology Inc

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1N5623GP International Semiconductor Inc

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Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC INTERNATIONAL SEMICONDUCTOR INC
Package Description HERMETIC SEALED, GLASS PACKAGE-2 O-PALF-W2
Reach Compliance Code compliant unknown
Samacsys Manufacturer Microchip
Application GENERAL PURPOSE
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code O-LELF-R2 O-PALF-W2
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Output Current-Max 1 A 1 A
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/429J
Reverse Recovery Time-Max 0.5 µs 0.5 µs
Surface Mount YES NO
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Base Number Matches 1 1
Part Package Code DO-15
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.80
Forward Voltage-Max (VF) 1.2 V
JEDEC-95 Code DO-15
Operating Temperature-Max 175 °C
Rep Pk Reverse Voltage-Max 1000 V

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