JANTXV1N5540CUR-1
vs
JANTX1N5540CUR-1TR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS, MLL34, MELF-2
HERMETIC SEALED, GLASS, MLL34, MELF-2
Reach Compliance Code
compliant
unknown
Factory Lead Time
20 Weeks
Additional Feature
METALLURGICALLY BONDED
TR, 7 INCH; 2000
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
100 Ω
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
R-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
RECTANGULAR
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
20 V
20 V
Surface Mount
YES
YES
Technology
AVALANCHE
AVALANCHE
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
2%
2%
Working Test Current
1 mA
1 mA
Base Number Matches
9
1
Part Package Code
DO-213AA
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Compare JANTXV1N5540CUR-1 with alternatives
Compare JANTX1N5540CUR-1TR with alternatives