JANTXV1N4370AUR-1
vs
JAN1N4370AUR-1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
M/A-COM TECHNOLOGY SOLUTIONS INC
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED, GLASS, LL34, MELF-2
MELF-2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Qualified
Reference Standard
MIL-19500/127
MIL-19500
Reference Voltage-Nom
2.4 V
2.4 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
5%
5%
Working Test Current
20 mA
20 mA
Base Number Matches
9
8
Rohs Code
Factory Lead Time
20 Weeks
Dynamic Impedance-Max
30 Ω
JESD-609 Code
e0
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Reverse Current-Max
100 µA
Reverse Test Voltage
1 V
Terminal Finish
Tin/Lead (Sn/Pb)
Voltage Temp Coeff-Max
-2.04 mV/°C
Compare JAN1N4370AUR-1 with alternatives