JANTX1N821
vs
JANHCA1N821
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MOTOROLA INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
O-LALF-W2
|
HERMETIC SEALED, DIE-3
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JEDEC-95 Code |
DO-204AA
|
|
JESD-30 Code |
O-LALF-W2
|
S-XUUC-N3
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
3
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
SQUARE
|
Package Style |
LONG FORM
|
UNCASED CHIP
|
Power Dissipation-Max |
0.4 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Voltage-Nom |
6.2 V
|
6.2 V
|
Surface Mount |
NO
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
WIRE
|
NO LEAD
|
Terminal Position |
AXIAL
|
UPPER
|
Voltage Temp Coeff-Max |
0.62 mV/°C
|
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
7.5 mA
|
7.5 mA
|
Base Number Matches |
7
|
4
|
Rohs Code |
|
No
|
Dynamic Impedance-Max |
|
15 Ω
|
JESD-609 Code |
|
e0
|
Reference Standard |
|
MIL-19500/159M
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare JANTX1N821 with alternatives
Compare JANHCA1N821 with alternatives