JANHCA1N821
vs
1N821-1
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
DIGITRON SEMICONDUCTORS
Part Package Code
DIE
Package Description
HERMETIC SEALED, DIE-3
Pin Count
3
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
kg CO2e/kg
8.7
Average Weight (mg)
1.1
CO2e (mg)
9.57
Category CO2 Kg
8.7
8.7
Candidate List Date
2018-06-27
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.10
Qualifications
Rad Hard
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
15 Ω
JESD-30 Code
S-XUUC-N3
O-XALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
3
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Reference Standard
MIL-19500/159M
Reference Voltage-Nom
6.2 V
6.2 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
NO LEAD
WIRE
Terminal Position
UPPER
AXIAL
Voltage Tol-Max
5%
4.84%
Working Test Current
7.5 mA
7.5 mA
Base Number Matches
4
8
Compliance Temperature Grade
Military: -65C to +175C
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
JEDEC-95 Code
DO-7
Operating Temperature-Min
-65 °C
Polarity
UNIDIRECTIONAL
Voltage Temp Coeff-Max
0.62 mV/°C
Compare JANHCA1N821 with alternatives
Compare 1N821-1 with alternatives